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HSMW-A400-xxxxx
Surface Mount LED Indicator
Data Sheet
Description
The Avago Technologies PLCC-4 family of SMT LEDs is packaged in the industry standard PLCC-4 Package and is a extension of our PLCC-2 SMT LEDs. The product is able to dissipate heat more efficiently compared to the conventional PLCC-2 SMT LEDs. In proportion to the increase in driving current, this family of LEDs is able to produce higher light output compared to the conventional PLCC-2 SMT LEDs. These SMT LEDs have higher reliability and better performance and are designed to work under a wide range of environment conditions. This higher reliability makes them suitable for use in harsh conditions such as the Interior Automotive, Electronics Signs and Signals and Office automation and Industrial applications. The super wide viewing angle at 120 makes these LEDs ideally suited for panel, push button, or general backlighting in automotive interior, office equipment, industrial equipment, and home appliances. The flat top emitting surface makes it easy for these LEDs to mate with light pipes. With the built-in reflector pushing up the intensity of the light output, these LEDs are also suitable to be used as LED pixels in interior electronic signs. These super high brightness LEDs can be used in localized area ambience lighting in applications such as vanity mirror light, cabin light, and car door puddle light. The white color backlighting is suitable to backlight color LCD screens in applications such as GPS (global positioning system) screens in cars. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin, to provide close uniformity. These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they can also be mounted using through-the-wave soldering process.
Features
* Industry Standard PLCC-4 * High reliability LED package * High brightness using InGaN dice technologies * High optical efficiency * Super wide viewing angle at 120 * Available in 8mm carrier tape on 7-inch reel * Tight White color Binning * Compatible with both IR and TTW soldering process
Applications
* Interior automotive - Instrument panel backlighting - Central console backlighting - Cabin lighting - Navigation and audio system - Dome lighting - Push button backlighting * Electronic signs and signals - Variable message sign - Garden lighting * Office automation, home appliances, industrial equipment - Front panel backlighting - Push button backlighting
CAUTION: HSMW-A40x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details
Package Dimensions
2.8 0.2 2.2 0.2 A C 0.1 TYP. 1.9 0.2 0.8 0.1
3.2 0.2
3.5 0.2
0.8 0.3 C C 0.7 0.1 CATHODE MARKING NOTE: ALL DIMENSIONS IN mm.
0.5 0.1
Device Selection Guide
Color White Part Number HSMW-A400-U00M2 Min. IV (mcd) 450.00 Typ. IV (mcd) 700.00 Max. IV (mcd) Test Current (mA) 30 Dice Technology InGaN
Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. IV tolerance = 12 %.
Absolute Maximum Ratings (TA=25C)
Parameters DC Forward Current [1] Peak Forward Current [2] Power Dissipation Reverse Voltage Junction Temperature Operating Temperature Storage Temperature
Notes: 1. Derate linearly as shown in Figure 3 2. Duty factor = 10%, Frequency = 1kHz
HSMW 30 mA 100 mA 114 mW 5V 110 C - 40 C to + 100 C - 40 C to + 100 C
2
Optical Characteristics (TA = 25 C)
Typical Chromaticity Coordinates [1] x 0.31 y 0.31 Viewing Angle 21/2 [2] (Degrees) Typ. 120 Luminous Efficacy V [3] (lm/W) Typ. 260 Luminous Intensity / Total Flux IV (mcd) / FV (lm) Typ. 0.45
Color White
Part Number HSMW-A400
Dice Technology InGaN
Notes: 1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device. 2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / V, where IV is the luminous intensity in candelas and V is the luminous efficacy in lumens / watt.
Electrical Characteristics (TA = 25 C)
Forward VoltageVF (Volts) @ IF =20 mA Reverse Voltage VR @ 100 mA Part Number HSMW Typ. 3.8 Max. 4.6 Min. Reverse Voltage VR @ 10 mA Min. 5
35 30 25 20 15 10 5 0 0 0.5 1 1.5 2 2.5 3 FORWARD VOLTAGE (V) 3.5 4 4.5
Figure 1. Forward Current Vs. Forward Voltage.
3
FORWARD CURRENT (mA)
1.2 1.0 RELATIVE INTENSITY 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 35 CURRENT (mA) Figure 2. Relative Intensity Vs. Forward Current 35 MAXIMUM FORWARD CURRENT - mA 30 25 20 15 10 5 0 0 20 40 60 80 100 120 AMBIENT TEMPERATURE - C Figure 3. Maximum Forward Current Vs. Ambient Temperature. Derated Based on TJMAX = 110C. 470C/W 300C/W 350C/W
1.0 0.9
RELATIVE INTENSITY
0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -70 -50 -30 -10 10 ANGLE (DEGREE) 30 50 70 90
Figure 4. Radiation Pattern
4
20 SEC. MAX.
TEMPERATURE
240 C MAX. 3C/SEC. MAX. 100-150 C 3C/SEC. MAX. 120 SEC. MAX. 60-150 SEC.
183 C - 6C/SEC. MAX.
TIME
Figure 5a. Recommended SnPb Reflow Soldering Profile.
10 to 20 SEC. 217 C +5 C 255 C -0 C 6 C/SEC. MAX.
TEMPERATURE
3 C/SEC. MAX. 125 C 25 C
MAX. 120 SEC.
60 to 150 SEC.
TIME * THE TIME FROM 25 C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 5b. Recommended Pb-free Reflow Soldering Profile.
TURBULENT WAVE
250
TEMPERATURE - C
LAMINAR WAVE HOT AIR KNIFE BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245 C AIR KNIFE AIR TEMPERATURE = 390 C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICENTLY COOLED BEFORE EXERTING MECHANICAL FORCE.
200 150
FLUXING
100 50 30 01 0
PREHEAT
20
30
40 50 60 TIME - SECONDS
70
80
90
100
Figure 6. Recommended Wave Soldering Profile.
5
2.60 (0.103) 1.10 (0.043)
X
X 0.40 (0.016)
0.50 (0.020) 4.50 (0.178) 1.50 (0.059)
Y
Y
DIMENSIONS IN mm (INCHES).
SOLDER RESIST
REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS
Figure 7a. Recommended Soldering Pad Pattern.
X 6.1 (0.240) 2.8 (0.110) Y 2.0 (0.079)
X 0.5 (0.020)
6.0 (0.236) 3.0 (0.118) 2.0 (0.079) Y 1.0 (0.039)
DIMENSIONS IN mm (INCHES).
Thermal Resistance 300 C/W 350 C/W 470 C/W
Solder Pad Area (xy) >16 mm2 >12 mm2 >8 mm2
SOLDER RESIST
REPRESENTS ELECTRICAL CONNECTIVITY BETWEEN PADS
Figure 7b. Recommended soldering pad pattern (TTW).
6
TRAILER 200 mm MIN. FOR 180 REEL. 200 mm MIN. FOR 330 REEL.
COMPONENT
LEADER 480 mm MIN. FOR 180 REEL. 960 mm MIN. FOR 330 REEL.
C
A
USER FEED DIRECTION
Figure 8. Tape leader and trailer dimensions.
+0.1 1.5 - 0
4 0.1
2 0.05
B
1.75 0.1
3.6 0.1
5.5 0.05 A A 3.8 0.1 +0.3 12 - 0.1
C
C
C 1 +0.1 -0 8 0.1 3.45 0.1 VIEW B-B
A
B 0.229 0.01
VIEW A-A ALL DIMENSIONS IN mm.
Figure 9. Tape Dimensions. USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL Figure 10. Reeling Orientation.
7
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - "10%" or "15%" HIC indicator turns pink. - The LEDs are exposed to condition of >30C / 60% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 605C for 20 hours.
8
Intensity Bin Select (X5X6)
Individual reel will contain parts from one half bin only X5 X6 0 3 4 5 7 8 9 Full Distribution 3 half bins starting from X51 4 half bins starting from X51 5 half bins starting from X51 3 half bins starting from X52 4 half bins starting from X52 5 half bins starting from X52 Min IV Bin
Color Bin Select (X7)
Individual reel will contain parts from one full bin only. X7 0 Z Y W V U Q P N M 1 3 Max. (mcd) 224.00 285.00 355.00 450.00 560.00 715.00 900.00 1125.00 1400.00 1800.00 4 5 6 Full Distribution A and B only B and C only C and D only D and E only E and F only A, B and C only B, C and D only C, D and E only D, E and F only A, B, C and D only B, C, D and E only C, D, E and F only A, B, C, D and E only B, C, D, E, and F only
Intensity Bin Limits
Bin ID S1 S2 T1 T2 U1 U2 V1 V2 W1 W2 Min. (mcd) 180.00 224.00 285.00 355.00 450.00 560.00 715.00 900.00 1125.00 1400.00
Tolerance of each bin limit = 12%
9
Color Bin Limits
Bin ID A B C D E F Limits (Chromaticity Coordinates) X Y X Y X Y X Y X Y X Y 0.352 0.377 0.340 0.360 0.327 0.342 0.315 0.325 0.302 0.307 0.290 0.290 0.365 0.395 0.352 0.377 0.340 0.360 0.327 0.342 0.315 0.325 0.302 0.307 0.365 0.360 0.352 0.341 0.340 0.325 0.327 0.306 0.315 0.290 0.302 0.271 0.352 0.341 0.340 0.325 0.327 0.306 0.315 0.290 0.302 0.271 0.290 0.255
Packaging Option (X8X9)
Option M2 Test Current 30 mA Package Type Top Mount Reel Size 7 inch
Tolerance of each bin limit = 0.02
For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0435EN AV02-0497EN - August 29, 2007

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